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阿普奇電阻觸摸屏工業(yè)一體機PGxxxRF-E7L系列H81平臺是一款功能強大的工業(yè)設(shè)備,具有電阻觸摸屏設(shè)計和模塊化設(shè)計,可選用17/19英寸屏幕,支持方屏和寬屏。前面板符合IP65要求,并集成了USB Type-A接口和信號指示燈。支持Intel ?第四/五代Core / Pentium / Celeron臺式CPU,TDP 35W,搭載Intel? H81芯片組。它還擁有2個英特爾千兆網(wǎng)絡(luò)接口和4個DB9串行端口,M.2和2.5英寸雙硬盤存儲支持,以及4個顯示輸出通道VGA,DVI-D,DP++和內(nèi)部LVDS,支持高達4K@60Hz的分辨率。 此外,該設(shè)備還支持9~36V直流電源供應(yīng)(12V可選)和機架安裝/VESA安裝。
總之,阿普奇電阻觸摸屏工業(yè)一體機PGxxxRF-E7L系列H81平臺是一款功能強大、靈活性高、適用范圍廣泛的工業(yè)設(shè)備,其電阻觸摸屏設(shè)計使其特別適合工業(yè)操作環(huán)境下的使用,而模塊化設(shè)計和多種安裝選項則使其更加靈活多變,對于需要高性能工業(yè)計算和控制的用戶來說,是一個理想的選擇。
| Model | PG170RF-E7L | PG190RF-E7L | |
| LCD | Display Size | 17.0" | 19.0" |
| Display Type | SXGA TFT-LCD | SXGA TFT-LCD | |
| Max. Resolution | 1280 x 1024 | 1280 x 1024 | |
| Luminance | 250 cd/m2 | 250 cd/m2 | |
| Aspect Ratio | 5:04 | 5:04 | |
| Viewing Angle | 85/85/80/80° | 89/89/89/89° | |
| Max. Color | 16.7M | 16.7M | |
| Backlight Lifetime | 30,000 hr | 30,000 hr | |
| Contrast Ratio | 1000:01:00 | 1000:01:00 | |
| Touchscreen | Touch Type | 5-Wire Resistive Touch | |
| Controller | USB signal | ||
| Input | Finger/Touch pen | ||
| Light Transmission | ≥78% | ||
| Hardness | ≥3H | ||
| Click lifetime | 100gf, 10 million times | ||
| Stroke lifetime | 100gf, 1 million times | ||
| Response time | ≤15ms | ||
| Processor System | CPU | Intel? 4/5th Generation Core / Pentium/ Celeron Desktop CPU | |
| TDP | 35W | ||
| Socket | LGA1150 | ||
| Chipset | Intel? H81 | ||
| BIOS | AMI UEFI BIOS (Support Watchdog Timer) | ||
| Memory | Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR3 up to 1600MHz | |
| Max Capacity | 16GB, Single Max. 8GB | ||
| Graphics | Controller | Intel? HD Graphics | |
| Ethernet | Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel i218-LM/V GbE LAN Chip (10/100/1000 Mbps) |
|
| Storage | SATA | 1 * SATA3.0, quick release 2.5-inch hard drive bay (T ≤ 7mm) 1 * SATA2.0, Internal 2.5" hard disk bays (T≤9mm, Optional) |
|
| M.2 | 1 * M.2 Key-M (SATA3.0, 2280) | ||
| Expansion Slots | MXM/aDoor | 1 * APQ MXM (Optional MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) 1 * aDoor Expansion Slot |
|
| Mini PCIe | 1 * Mini PCIe (PCIe2.0 x1 (Share PCIe signal with MXM, optional) + USB 2.0, with 1*Nano SIM Card) | ||
| Front I/O | Ethernet | 2 * RJ45 | |
| USB | 2 * USB3.0 (Type-A, 5Gbps) 4 * USB2.0 (Type-A) |
||
| Display | 1 * DVI-D: max resolution up to 1920*1200 @ 60Hz 1 * VGA (DB15/F): max resolution up to 1920*1200 @ 60Hz 1 * DP: max resolution up to 4096*2160 @ 60Hz |
||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | ||
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M) |
||
| Button | 1 * Power Button + Power LED 1 * System Reset Button (Hold down 0.2 to 1s to restart, and hold down 3s to clear CMOS) |
||
| Rear I/O | Antenna | 4 * Antenna hole | |
| SIM | 1 * Nano SIM card slot (SIM1) | ||
| Internal I/O | USB | 2 * USB2.0 (wafer) | |
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | ||
| TFront Panel | 1 * TF_Panel (3 * USB 2.0 + FPANEL, wafer) | ||
| Front Panel | 1 * Front Panel (PWR + RST + LED, wafer) | ||
| Speaker | 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) | ||
| Serial | 2 * RS232 (COM5/6, wafer) | ||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||
| LPC | 1 * LPC (wafer) | ||
| SATA | 2 * SATA 7P Connector | ||
| SATA Power | 2 * SATA Power (SATA_PWR1/2, wafer) | ||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (wafer) |
||
| Power Supply | Type | DC, AT/ATX | |
| Power Input Voltage | 9 ~ 36VDC, P≤240W | ||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | ||
| RTC Battery | CR2032 Coin Cell | ||
| OS Support | Windows | Windows 7/10/11 | |
| Linux | Linux | ||
| Watchdog | Output | System Reset | |
| Interval | Programmable via Software from 1 to 255 sec | ||
| Mechanical | Enclosure Material | Radiator/Panel: Aluminum, Box/Cover: SGCC | |
| Mounting | Rack-mount, VESA | ||
| Dimensions | 482.6mm(L) * 354.8mm(W) * 98.7mm(H) | 482.6mm(L) * 354.8mm(W) * 97.7mm(H) | |
| Weight | Net: 8.7kg, Total:11.7kg | Net: 9.kg, Total: 13.1kg | |
| Environment | Heat Dissipation System | Passive heat dissipation | |
| Operating Temperature | 0~50℃ | 0~50℃ | |
| Storage Temperature | -20~60℃ | -20~60℃ | |
| Relative Humidity | 10 to 95% RH (non-condensing) | ||
| Vibration During Operation | With SSD: IEC 60068-2-64 (1Grms@5~500Hz, random, 1hr/axis) | ||
| Shock During Operation | With SSD: IEC 60068-2-27 (15G, half sine, 11ms) | ||

