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E7Pro系列Q670平臺(tái) 嵌入式工控機(jī)/邊緣AI平臺(tái)/邊緣計(jì)算控制器

E7Pro系列Q670平臺(tái) 嵌入式工控機(jī)/邊緣AI平臺(tái)/邊緣計(jì)算控制器

特點(diǎn):

  • Intel? LGA1700 12/13 th 處理器,支持Core? i3/i5/i7/i9,Pentium?及Celeron?系列TDP=65W
  • 搭配Intel? Q670芯片組
  • 2路網(wǎng)絡(luò) (1 * 1GbE&1 * 2.5GbE)
  • 3路顯示輸出 HDMI,DP++和內(nèi)部LVDS, 最高支持4K@60Hz分辨率
  • 豐富的USB、串口擴(kuò)展接口和擴(kuò)展插槽PCIe、mini PCIe 和M.2
  • DC18-62V 寬壓輸入,額定功率可選 600/800/1000W
  • 無風(fēng)扇被動(dòng)式散熱

  • 遠(yuǎn)程管理

    遠(yuǎn)程管理

  • 狀態(tài)監(jiān)控

    狀態(tài)監(jiān)控

  • 遠(yuǎn)程運(yùn)維

    遠(yuǎn)程運(yùn)維

  • 安全控制

    安全控制

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產(chǎn)品描述

阿普奇邊緣AI平臺(tái)E7 Pro系列Q670平臺(tái)是一款專為邊緣計(jì)算研發(fā)的嵌入式工控機(jī),具備強(qiáng)大的計(jì)算能力和豐富的功能特點(diǎn)。搭載了Intel? LGA1700 12/13th處理器,支持Core? i3/i5/i7/i9、Pentium?及Celeron?系列,能夠提供強(qiáng)大的數(shù)據(jù)處理和計(jì)算能力,使得E7 Pro系列Q670平臺(tái)在處理復(fù)雜的AI算法和大量數(shù)據(jù)時(shí)能夠保持高效率和準(zhǔn)確性。搭配Intel? Q670芯片組確保了AI平臺(tái)的可靠性和高效性,使得E7 Pro系列Q670平臺(tái)能夠滿足各種邊緣計(jì)算應(yīng)用的需求。具備豐富的擴(kuò)展接口和插槽,配備了PCIe、mini PCIe和M.2等擴(kuò)展插槽,支持各種擴(kuò)展卡和模塊的連接。這種擴(kuò)展能力使得E7 Pro系列Q670平臺(tái)能夠根據(jù)具體應(yīng)用需求進(jìn)行定制和配置,滿足各種邊緣計(jì)算應(yīng)用的擴(kuò)展需求。在散熱方面,E7 Pro系列Q670平臺(tái)采用了先進(jìn)的無風(fēng)扇被動(dòng)式散熱設(shè)計(jì),有效地降低了噪音并提高了散熱效率,確保了AI平臺(tái)在長時(shí)間運(yùn)行時(shí)仍能保持穩(wěn)定。

綜上所述,阿普奇邊緣AI平臺(tái)E7 Pro系列Q670平臺(tái)憑借強(qiáng)大的計(jì)算能力、穩(wěn)定的系統(tǒng)性能、豐富的擴(kuò)展智能安防、智慧交通、智能接口和插槽以及高效的散熱設(shè)計(jì)等特點(diǎn),滿足了現(xiàn)代邊緣計(jì)算應(yīng)用的需求。無論是在制造等領(lǐng)域,還是在其他需要高性能邊緣計(jì)算的場景中,E7 Pro系列Q670平臺(tái)嵌入式工控機(jī)都能發(fā)揮出色的性能,成為推動(dòng)邊緣計(jì)算技術(shù)發(fā)展的強(qiáng)大引擎。

產(chǎn)品介紹

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Model

E7 Pro

CPU

CPU Intel? 12th /13th Gen Core/Pentium/Celeron desktop processor
TDP 65W
Socket LGA1700
Chipset Q670
BIOS AMI 256 Mbit SPI

Memory

Socket 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 3200MHz
Max Capacity 64GB,Single Max. 32GB

Graphics

Controller Intel? UHD Graphics

Ethernet

Controller 1 * Intel i219-LM 1GbE LAN Chip (LAN1, 10/100/1000 Mbps, RJ45)
1 * Intel i225-V 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps, RJ45)

Storage

SATA 3 * SATA3.0, Quick release hard disk bays (T≤7mm) ,?Support?RAID?0, 1, 5
M.2 1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280)

Expansion Slots

PCIe Slot Support PCIe module card(1*PCIe x 16+1*PCIe x4/1*PCIe x16+3*PCI/2*PCIe x8+2*PCI)
PS:Expansion Card length limited 320mm,TDP limited 450W
aDoor aDoor1 for expansion serial function( ex:COM /CAN)

aDoor2 for expansion APQ aDoor expansion module AR series

Mini PCIe 1 * Mini PCI-E Slot (PCIe x1+USB,Wifi/3G/4G supported, with 1 * Nano SIM Card Slot)
1 * Mini PCI-E Slot (PCIe x1+USB,Wifi/3G/4G supported, with 1 * Nano SIM Card Slot)
M.2 1 * M.2 Key-E slot(PCIe+USB, Wifi+BT,2230)

Front I/O

Ethernet 2 * RJ45
USB 2 * USB3.2 Gen 2x1 (Type-A, 10Gbps)
6 * USB3.2 Gen 1x1 (Type-A, 5Gbps)
Display 1 * HDMI1.4b: max resolution up to 4096*2160@30Hz
1 * DP1.4a: max resolution up to 4096*2160@60Hz
Audio Realtek ALC269Q-VB6 5.1 Channel HDA Codec
1 * Line-Out + MIC 3.5mm Jack
Serial 2 * RS232/485/422 (COM1/2, DB9/M, Full Lanes,BIOS Switch)
2 * RS232 (COM3/4, DB9/M, Full Lanes)
Button 1 * Power Button/LED
1 * AT/ATX Button
1 * OS Recover Button
1 * System Reset Button

Rear I/O

Antenna 6 * Antenna hole

Internal I/O

USB 6 * USB2.0(wafer, Internal I/O)
LCD 1 * LVDS (wafer): LVDS Resolution up to 1920*1200@60Hz
Front Panel 1 * FPanel (FPANEL, PWR+RST+LED,wafer,5 x 2pin,P=2.0)
Audio 1 * Audio (Header, 5x2pin, 2.54mm)
1 * Speaker (2W 8Ω, wafer, 4x1pin, PH2.0)
Serial 2 * RS232 (COM5/6, wafer, 8x2pin, PHD2.0)
GPIO 1 * 16 bits DIO (8xDI and 8xDO, wafer, 10x2pin, PHD2.0)
LPC 1 * LPC (wafer, 8x2Pin, PHD2.0)
SATA 3 * SATA3.0 7P Connector, up to 600MB/s
SATA Power 3 * SATA Power (wafer, 4x1Pin, PH2.0)
SIM 2 * Nano SIM
FAN 2 * SYS FAN (4x1Pin, KF2510-4A)

Power Supply

Type DC, AT/ATX
Power Input Voltage 18~62VDC,P=600/800/1000W
Connector 1 * 3Pin Connector, P=10.16
RTC Battery CR2032 Coin Cell

OS Support

Windows Windows 10/11
Linux Linux

Watchdog

Output System Reset
Interval Programmable 1 ~ 255 sec

Mechanical

Enclosure Material Radiator: Aluminium, Box: SGCC
Dimensions 363mm(L) * 270mm(W) * 169mm(H)
Weight Net:10.48 kg, Total:11.38 kg(Include packaging)
Mounting VESA, Wallmount,Desk mounting

Environment

Heat Dissipation System Fanless(CPU)
2*9cm PWM FAN(Internal)
Operating Temperature -20~60℃?(SSD or M.2 Storage)
Storage Temperature -40~80℃
Relative Humidity 5 to 95% RH (non-condensing)
Vibration During Operation With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
Shock During Operation With SSD: IEC 60068-2-27 (30G, half sine, 11ms)

 

E7 Pro Series

  • E7Pro系列Q670平臺(tái) 嵌入式工控機(jī)/邊緣AI平臺(tái)/邊緣計(jì)算控制器

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